Muaj ntau qhov kev tshawb nrhiav tau ua nyob rau hauv ib qho kev tshawb fawb ntawm Raymond C. Rumpf, PhD, tus Schellenger xibfwb hauv kev tshawb fawb hluav taws xob hauv University of Texas hauv El Paso's College of Engineering. Dr. Rumpf ua tus EM Lab, uas yog rau kev tshawb fawb thiab kev loj hlob ntawm cov ntsiab lus siab ntawm electromagnetism thiab photonics uas ua rau 3D printing tau. Qhov kev nce qib tshiab uas ua los ntawm lub chaw kuaj ntshav yog ib qho zoo tshaj plaws - ua ntej xyoo no, cov neeg tshawb nrhiav ua tiav qhov tseeb thawj ntu ntawm qhov tseeb ntawm qhov sib luag kom tiav raws li siv cov txheej txheem sib kho.
Kev tshawb nrhav 3-dimensional yuav ua tau me dua, sib zog thiab ntau dua li lwm yam circuits, thiab 3D printing tso cai rau lawv ua rau cov cim duab uas tau muab faib rau txhua yam khoom los yog qhov chaw.
Robles thiab Valle, thiab cov kws kho mob cov tub ntxhais kawm, tau pab tau. Nyuam qhuav pib thaum lub caij ntuj sov, Robles ua tiav ib qho interface uas yuav hloov tau cov qauv tsim hluav taws xob rau hauv txoj cai uas cov tshuab 3D yuav siv los luam cov Circuit Court nyob rau hauv ib kauj ruam.Valle thiab Carranza ces zoo-tuned cov txheej txheem thiab siv los tsim thawj 3D volumetric Circuit .
